ADI Electronics

Description

HMC651 & HMC658. Die Size: 0.57 x 0.45 x 0.1 mm. HMC650, HMC652, HMC653, HMC654. HMC655, HMC656 & HMC657. Die Size: 0.42 x 0.45 x 0.1 mm. HMC-C018. HMC-C025. HMC424. HMC424LP3E. HMC542LP4E. HMC624LP4E . HMC-C018. HMC-C025. Attenuators: Passive. HMC650. HMC651 . HMC652. The testing performed for this report is designed to accelerate the predominant failure mode, electro-migration. (EM), for the devices under test. The devices are (dBm). Chip Size mils (mm). Package Quantity. HMC650. DC - 50. Thru Line. 0.2. 0.15. -. 20 x 21 x 4. (0.51 x 0.54 x 0.1). Chip. 10. HMC651 . DC - 50. Thru Line . HMC651 . Through line. 0 to 50. 0.15. 0.2. . 23 18. Die. EAR 99. HMC651 HMC652. Fixed passive. 0 to 50. 2. 0.2. 27. 17 18. Die. EAR 99. HMC652.